Welcome Speech
Dato’ Seri Wong Siew Hai
President, MSIA

Opening Remarks
YB Sim Tze Tzin
Deputy Minister, Ministry of Investment, Trade and Industry

Micron: Opportunities / Requirements / Processes
Jacky Hoi
Senior Director of Global Procurement, Assembly/Test Materials & Outsourcing

Intel: Opportunities / Requirements / Processes
Teh Hock Hin
Backend Strategic Parts Sourcing Director

Texas Instruments: Opportunities / Requirements / Processes
Chen Siow Wie
Procurement Director

Sandisk: Opportunities / Requirements / Processes
Lim Boon Soo
Vice President & General Manager, SDSM Global Operations

Import Minimization
Abu Bakar Yusof
Chief Executive Officer, Malaysia External Trade Development Corporation (MATRADE)

LAM Research: Opportunities / Requirements / Processes
Dr. Nic Rossi
Vice President of Global Supply Chain

Infineon: Opportunities / Requirements / Processes
Lee Kok Eng
Senior Director of Procurement

Advanced Packaging Market Analysis & Trends
Dr. YY Tan
Principal Technologies & Market Analyst, Yole Group

Advanced Packaging in the Global Arena: Where Does Malaysia Stand?
Dr. YT Chin
CEO, Silicon Connect

Advanced Packaging - Process and Complexities
Dr. Eu Poh Leng
Senior Director, Package Innovation, NXP Semiconductor

Localization Opportunities in Advanced Packaging and Standard Assembly & Test
CS Tan
Honourary Board Member, MSIA